Advanced Simulation

Utilizing advanced simulation technologies, we offer the best package solution.

Mechanism Simulation

Incorporating mechanism simulation into package design allows customers to propose high reliability packages.

[Case: Stress Analysis of Solder Joint Sections]

Thermal design Simulation

By combining actual measurement of thermal resistors and thermofluid simulation, we perform high accuracy thermal resistance analysis reproducing the operating environment of products. Analysis in an environment defined by the JEDEC standard is also possible.

Thermal resistance measurements

Measurement of transient thermal resistance values in accordance with the JEDEC standard JESD51-14 is possible.

Products / Services

Custom SoC (ASIC)