Socionext will present at 14th ICSEVEN 2024

Socionext will be presenting at the 13th IEEE & 14th International Conference on Science, Education and Viable Engineering (14th ICSEVEN 2024) in Four Points by Sheraton Kuala Lumpur, Chinatown (Kuala Lumpur, Malaysia) from April 14 to April 17, 2024.

This conference is organized by Taiwan Association for Academic Innovation (TAAI), and IEEE Electron Device Society Tainan Chapter.

In the keynote presentation, Socionext will present research results obtained from various measurements (VF-TLP and CDM) and simulations using a test chip made with cutting-edge CMOS technology to establish an ESD (Electro-Static Discharge) protection design method using T-Coil for high-speed interface.

Event Information

Title The 13th IEEE & 14th ICSEVEN 2024
Period Sunday, April 14 to Wednesday, April 17 2024 9:00 to 17:00(MYT)
Venue Four Points by Sheraton Kuala Lumpur, Chinatown (Kuala Lumpur, Malaysia)
Organizers IEEE, TAAI

Socionext Presentation

Date/Time Sunday, April 14 2024 10:30 to 11:00(MYT)
Title [Keynote Presentation]
Consideration based on ESD applied waveform in High-Speed IF using T-Coil
Speaker Teruo Suzuki
Principal Engineer
Technology Development Division, Global Development Group, Socionext Inc.