Socionext to present at CHIPLET SUMMIT 2026
Socionext will deliver a presentation at CHIPLET SUMMIT 2026, to be held from Tuesday, February 17 to Thursday, February 19, 2026.
In this presentation, the company will propose a transmission technology that achieves long-reach die-to-die interconnects in advanced packages integrating chiplets.
Event Information
| Title | CHIPLET SUMMIT 2026 |
|---|---|
| Period | Tuesday, February 17 to Thursday, February 19, 2026 |
| Venue | Santa Clara Convention Center (Santa Clara, California, USA) |
| Organizer | Semper Technologies |
Socionext Presentation
●Session : B-102: Die-to-Die Interfaces - 2: Advanced Packaging
| Date/Time | Wednesday, February 18, 2026 15:45 to 16:45 (Local Time) |
|---|---|
| Venue | GAMR 2 |
| Title | THz/RF corridors as a General in-package Fabric |
| Speaker | Mohammad Kolbehdari Director, Package Design, Socionext America Inc. |