Socionext will present at TSMC 2025 Japan OIP Ecosystem Forum
Socionext will present at TSMC 2025 Japan OIP* Ecosystem Forum on Friday, October 24, 2025.
At this forum, Socionext will present its efforts for advanced process and packaging technologies during the guest speech, and will also highlight its joint efforts and achievements with Synopsys in developing 3DIC test chips that integrate dies from different process technologies.
Event Information
| Title | TSMC 2025 Japan OIP Ecosystem Forum(Japanese version only) |
|---|---|
| Date/Time | Friday, October 24, 2025 9:30 to 17:00 (JST) |
| Venue | Grand Hyatt Tokyo (Minato-ku, Tokyo) |
| Organizer | Taiwan Semiconductor Manufacturing Company Limited |
Socionext Presentation
●Session : Guest Speech
| Date/Time | Friday, October 24, 2025 9:45 to 10:00 (JST) |
|---|---|
| Title | Driving the Evolution of Advanced Process and Packaging Technologies: Challenges and Our Efforts |
| Speaker | Toshifumi Iwasaki Chief Engineer, Global Leading Group, Socionext Inc. |
●Session : HPC & 3DFabric Track (A-9)
| Date/Time | Friday, October 24, 2025 15:40 to 16:00 (JST) |
|---|---|
| Title | Accelerating SOIC-X 3D-Stacked Advanced Package Design: From Architecture Planning and Optimization to Tapeout |
| Speaker | Masato Suga Lead, Advanced Technology Unit, Global Leading Group, Socionext Inc. |