Socionext to Present and Exhibit at DesignCon 2026
Socionext will showcase its latest innovations in heterogeneous integration, high-speed package design, and system-level co-optimization at DesignCon 2026, which will be held from Tuesday, February 24 to Thursday, February 26, 2026
These advanced technologies--which enable the performance and reliability required for future AI, HPC, and ADAS applications--will be highlighted through technical presentations and collaborative technology demonstrations.
Event Information
| Title | DesignCon 2026 |
|---|---|
| Period | Tuesday, February 24 to Thursday, February 26, 2026 |
| Venue | Santa Clara Convention Center (Santa Clara, California, USA) |
| Organizer | Informa Markets |
Socionext Presentation
●Session : Sponsored Session - Keysight Education Forum
| Date/Time | Wednesday, February 25, 2026 12:40 PM to 1:20 PM (Local Time) |
|---|---|
| Venue | Great America Ballroom K |
| Title | Toward 448Gbps: Validating Package Design at 224G with Simulation-to-Measurement Correlation |
| Speakers | Masaki Fujioka / Engineer Futoshi Terasawa / Engineer (Socionext America Inc.) Design Execution Leading Unit, Global Leading Group, Socionext Inc. |
●Session : Technical Paper Session
| Date/Time | Thursday, February 26, 2026 8:00 AM to 8:45 AM (Local Time) |
|---|---|
| Venue | Ballroom G |
| Title | Adv. SoC/IC Packaging Architecture |
| Speaker | Mohammad Kolbehdari Director, Package Design, Socionext America Inc. |
●Session : Panel Discussion - Advance Packaging Technology
| Date/Time | Thursday, February 26, 2026 4:00 PM to 5:15 PM (Local Time) |
|---|---|
| Venue | Ballroom F |
| Title | Advanced SoC/IC Packaging Technologies |
| Moderator | Mohammad Kolbehdari Director, Package Design, Socionext America Inc. |
Exhibitor Information
| Exhibitor | Japan Aviation Electronics Industry, Ltd. (Booth No. 804) |
|---|---|
| Exhibition | 224Gbps SerDes Cable Interconnect Live Demonstration (jointly with Japan Aviation Electronics Industry, Ltd. and Yamaichi Electronics Co., Ltd.) |