Socionext to Present at 2026 TSMC North America OIP Ecosystem Forum
Socionext Inc. will present at 2026 TSMC North America OIP Ecosystem Forum, which will be held on September 23, 2026, at the Santa Clara Convention Center in USA.
TSMC OIP Ecosystem Forum is a semiconductor technology forum that brings together companies participating in TSMC's Open Innovation Platform (OIP) ecosystem. Attendees will gain insights into the latest technologies and real-world applications in areas such as advanced process technologies, advanced packaging, chiplets, and EDA/IP solutions.
Following its kickoff event in Santa Clara, California, USA, on September 23, the forum will be held sequentially in locations around the world, providing opportunities for industry professionals to explore emerging innovations and connect with ecosystem partners.
At this forum, Socionext, in collaboration with Cadence Design Systems, will present a case study on the automation and optimization of chiplet package routing using advanced EDA tools.
Event Information
| Title | 2026 TSMC North America OIP Ecosystem Forum |
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| Date/Time | Wednesday, September 23, 2026, 8:30 AM to 6:00 PM (Local Time) |
| Venue | Santa Clara Convention Center (Santa Clara, CA, USA) |
| Organizer | Taiwan Semiconductor Manufacturing Company Limited |
Socionext Presentation
●Track : 3D IC Track
| Date/Time | Wednesday, September 23, 2026, 2:50 PM to 3:10 PM (Local Time) | Title | LPDDR6 and UCIe interface routing automation and optimization use cases using ASR* Cadence Design Systems / Socionext*: ASR(Advanced Substrate Router) |
|---|---|
| Speaker | Atsushi Sato, Principal Engineer Advanced Technology Unit, Global Leading Group Socionext Inc. |