Flexlets™
Introducing Flexlets™* -- Configurable Chiplets
the demands of next-gen multi-die systems
Why Flexlets
As monolithic SoC designs approach physical and economic limits--reticle size constraints, yield challenges, and thermal bottlenecks--the semiconductor industry is shifting toward chiplet-based architectures. The Flexlets family from Socionext represents a breakthrough in this evolution: a new class of configurable chiplets designed to unlock the full potential of modular design.
Traditional chiplet solutions often rely on fixed-function ASSPs, limiting flexibility and customization. Flexlets change the game by offering a configurable RTL-level chiplet library, enabling customers to tailor performance to their unique application needs whether in high-performance computing, advanced networking, or next-generation automotive systems.
What are Flexlets
Flexlets are RTL-composable chiplets that give customers the freedom to integrate their own custom logic and select best-in-class IP from any vendor. Designed to shorten design cycles and accelerate time-to-revenue, Flexlets combine configurability with high performance across a wide range of applications.
The Flexlets Advantage
Socionext is launching a portfolio of flexlets, each integrating security, debug features, and optimized interfaces. Engineering samples, including Known Good Die (KGD), are in development. Availability details will be announced soon
RTL Composability
Co-design at the register-transfer level to create differentiated features and integrate third-party IP
Flexible Engagement Models
Align design support and collaboration to match product timelines and go-to-market strategies
Advanced Packaging Technologies Models
A complete suite of advanced packaging technologies -- including CoWoS, SoW-X, EMID, and 3D stacking
Intuitive Design Tool (Coming Soon)
A web-based, drag-and-drop configurator with a curated IP library to quickly conceptualize, configure, and validate chiplet designs
Features
Advanced Packaging compatibility for 2.5D and 3D integration
Supports for leading-edge process nodes, including 2nm, 3nm, and 5nm
Standard high-speed interfaces: UCIe, UALink, PCIe Gen7, Ultra Ethernet
Flexlets Portfolio
[Our initial lineup]
| Flexlets | Description |
|---|---|
| Memory Expansion Flexlets | Scalable memory solutions with support for the latest DDR/LPDDR standards connected to either UCIe-S or UALink |
| Ethernet Controller Flexlets | Robust and high-performance networking connectivity via 224G/UE bridged to UCIe 2.0 |
| PCIe Controller Flexlets | Seamless integration to PCIe ecosystem by bridging PCIe Gen7 128G PHY to UCIe 2.0 with configurable lanes |
| Hybrid PCIe + Ethernet Controller Flexlets |
A versatile range of I/O capabilities, bridging high-speed SerDes (224G/UE) to UCIe 2.0 |
Socionext provides the credibility, capability, and customization needed to build next-generation chiplet-based systems. Flexlets are your gateway to faster time-to-market, optimized performance, and differentiated design.
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